Degradation of Carbon Nanotube Array Thermal Interface Materials through Thermal Aging: Effects of Bonding, Array Height, and Catalyst Oxidation

Effects of Growth Temperature on Carbon Nanotube Array Thermal Interfaces

Contact mechanics and thermal conductance of carbon nanotube array interfaces

A model is developed in this work to predict the thermal contact resistance of carbon nanotube (CNT) array interfaces with CNT arrays synthesized directly on substrate surfaces. An analytical model for contact mechanics is first developed in conjunction with prior data from load–displacement experiments to predict the real contact area established in CNT array interfaces as a function of applie...

Photoacoustic characterization of carbon nanotube array thermal interfaces

This work describes an experimental study of thermal conductance across multiwalled carbon nanotube CNT array interfaces, one sided Si-CNT-Ag and two sided Si-CNT-CNT-Cu , using a photoacoustic technique PA . Well-anchored, dense, and vertically oriented multiwalled CNT arrays have been directly synthesized on Si wafers and pure Cu sheets using plasma-enhanced chemical vapor deposition. With th...

Enhancement of thermal interface materials with carbon nanotube arrays

This paper describes an experimental study of thermal contact conductance enhancement enabled by carbon nanotube (CNT) arrays synthesized directly on silicon wafers using plasma-enhanced chemical vapor deposition. Testing based on the one-dimensional reference bar method occurred in a high-vacuum environment with radiation shielding, and temperature measurements were made with an infrared camer...

A metallization and bonding approach for high performance carbon nanotube thermal interface materials.

A method has been developed to create vertically aligned carbon nanotube (VACNT) thermal interface materials that can be attached to a variety of metallized surfaces. VACNT films were grown on Si substrates using standard CVD processing followed by metallization using Ti/Au. The coated CNTs were then bonded to metallized substrates at 220 °C. By reducing the adhesion of the VACNTs to the growth...